Rumor: iPhone 5 to have ultrasonic bonding to make it stronger?

Apple and Apple products have always been hot topics of speculation around the web. After the release of the New iPad, all of the user attention has been shifted towards speculating about possible features of the iPhone 5.

There are speculations that the Apple will be launching its iPhone 5 is the second half of the 2012. The latest rumor is about the ultrasonic bonding. According to the patent application published from the US patent and Trademark Office that enhances older 2008 patent on use of ultrasonic bonding, ultrasonic bonding is used in devices like the 2009 metal black iPhone and today’s iPods .

Apple may use ultrasonic bonding to bring metal and plastic together and at the same time save on cost. Various iPods and older iPhone models are utilizing the same feature. It’s better than adhesive in bonding metal and plastic together.

However, the main challenge with the ultrasonic binding is difference in the melting point of the metal and plastic. This actually restricts the skills of the designers in according to the material that can be sued for a particular design, such as in housing of the internal electronic components and internal features.

For this Apple actually opts for a metallic surface that can withstand the flow of the molten plastic into surface irregularities of the metal, allowing the plastic to bond ultrasonically with the metal part.

Image source: Patently Apple